Metallography & Ceramography Polishing
Ceramography is the branch of material science that deals with the study of ceramics and their properties. Ceramics are used in a wide range of applications such as in the construction of buildings, medical implants, and electronic devices. In order to study the structure and properties of ceramics, it is necessary to prepare a polished surface that can be analysed under a microscope. The preparation of polished surfaces for ceramics is known as ceramography polishing.
Ceramography polishing is a critical step in the preparation of ceramic samples for analysis. The surface of a ceramic sample must be polished to a high degree of flatness and smoothness to ensure that the analysis is accurate and reproducible. Polishing removes any surface defects, scratches, or other imperfections that may interfere with the analysis. It also helps to reveal the microstructure of the ceramic sample, which is essential in understanding its properties.
The process of ceramography polishing involves several steps, including grinding, lapping, and polishing. Grinding is the first step in the process, and it involves removing a thin layer of material from the surface of the ceramic sample using an abrasive material such as diamond compounds. Lapping is the next step, which involves the use of a finer abrasive material to remove any surface defects or scratches left from the grinding process. The final step is polishing, which involves the use of a polishing compound to achieve a mirror-like finish on the surface of the ceramic sample.
The choice of diamond compounds used in ceramography polishing is critical to the success of the process. The particle size of the diamond compound must be carefully selected based on the type of ceramic being polished and the desired level of surface finish. Diamond compounds are available in a range of particle sizes, ranging from coarse to fine, and each size has its own specific application.
In addition to the choice of diamond compounds, the polishing process itself must be carefully controlled to ensure a uniform surface finish. The pressure, speed, and direction of the polishing must all be carefully monitored to achieve the desired result.
| Micron Size | Use |
|---|---|
| 0.1 to 3 | Final polishing on metallographic specimens, also used on optical, laser rod and semiconductor finishing. |
| 3 to 25 | Fine grinding/polishing on metallographic specimens. Also as a finish for most applications: moulds: dies, general flat lapping. Preparatory lapping. Intermediate finish to achieve dimensions. |
| 25 to 90 | Rough grinding, fast stock removal and roughing on hard materials. |
Kemet Monocrystalline Diamond provides a cost effective means for good stock removal and finish. It has a slightly irregular shape with multiple cutting edges, and is recommend for general applications where Polycrystalline features are not required.
Kemet Polycrystalline Diamond has many more cutting surfaces per particle, resulting in higher removal rate. As it cuts, it breaks down in its original shape, allowing for finer finishes in less time than when using Monocrystalline Diamond. Because Polycrystalline has no cleavage planes, it cannot crack or splinter like Monocrystalline Diamond. It causes less sub-deformation, and is excellent when polishing samples composed of different material/hardness.
Kemet Diamond Compound
Kemet Diamond Suspensions
Kemet Polishing Pads
Polishing is the most time consuming and most important step in preparing a specimen for micro-structural analysis. Here any damage caused by the previous cutting and grinding, which should have been kept to a minimum, is completely eliminated. There are a wide range of Polishing Pads, which relate to their type:- woven, non-woven and napped cloths.
Ceramography polishing is a critical step in the preparation of ceramic samples for analysis. It involves the use of diamond compounds to grind, lap, and polish the surface of the ceramic sample to a high degree of flatness and smoothness. The choice of diamond compounds and the polishing process itself must be carefully controlled to achieve a uniform surface finish that is essential for accurate and reproducible analysis of the ceramic sample.
