Polishing Paste and Lapping Compounds
Silicon Carbide Lapping Compound
In some cases Silicon Carbide is the preferred abrasive for precision lapping, cutting and smoothing of metal surfaces. Kemet Silicon Carbide Lapping Compound retains its texture and lubrication properties during extended lapping operations.
Sabre Aluminium Oxide Polishing Paste
Sabre Abrasive Paste is specially formulated containing Aluminium Oxide Abrasive and is available in 20g syringes. It is suitable for a wide range of lapping/polishing operations, and it is particularly effective when used for smoothing soft metals such as brass, aluminium and copper; it is also effective for smoothing small areas of glass prior to polishing. Sabre Pastes are also available based on both silicon carbide and boron carbide abrasives.
Simichrome Metal Polishing Paste
One of the finest all-metal paste polishes in the world! Simply rub on with a soft cloth and rub off to obtain a brilliant luster. Will not harm uncoated metal surfaces. Unlike chemical polishes, it will not remove a layer of the metal surface being cleaned. Recommended for use after diamond lapping compound. Removes tarnish, dirt and oils, and generally renews polished metal surfaces. Leaves a protective film, which retards oxidation but does not prevent tarnishing. Works well on virtually any ferrous or non-ferrous metal surface such as brass, copper, silver, gold, pewter, magnesium, bronze, chromium, stainless steel, platinum, aluminum and countless other similar uncoated metals. Do not use on painted or lacquered surfaces. Excellent for removing shallow scratches from most any plastic and is also used to charge dry polishing medias (such as Dri-Shine III, Walnut Shells, or crushed cob) for tumbling. Available in 50g (code: 300515) or 250g (code: 300516)
Diamond Lapping Compound
For hand lapping applications Kemet offer a huge range of Diamond Lapping Compounds for rapid stock removal, superfine surface finish, lapping and pre-polishing. Micron sizes ranging from 1/10 to 90, soluble in either oil (Type L), water (Type W) or both (Type KD). High thermal stability of the chemical carrier ensures that Kemet Diamond Lapping Compound resists frictional heat, remains stable, and keeps its suspension properties under operating conditions. For our full range, please view our website or tool room catalogue.
- Oil Soluble Diamond Lapping Compound specially developed for use on hard materials such as Tungsten Carbide, hardened Steels and Ceramics.
- High thermal stability of the chemical carrier ensures that Kemet Diamond Lapping Compound resists frictional heat, remains stable, and keeps its suspension properties under operating conditions.
- Recommended for Toolroom and General Production applications.