Super Finishing Machine: The Kemet DiaCol
The Kemet DiaCol is a versatile machine designed for lapping, polishing, and super finishing of various components using a wide range of processes. It is used in various industries, including aerospace, automotive, medical, and semiconductor manufacturing, for precision lapping and polishing of critical components. Its features, including its stainless steel adjustable worktable, conditioning rings and roller bearing assemblies, epoxy-coated support plate, stainless steel pressure weights, and Kemet diamond dispensing system and stirrer, ensure efficient and effective lapping and polishing. The machine's compatibility with the Kemet magnetic polishing pad system makes changing polishing pads easy. The Kemet DiaCol machine is an excellent choice for precision lapping and polishing of critical components in various industries. The Kemet DiaCol is available in three sizes: 15”, 20”, and 24”, to suit different applications.
The Kemet DiaCol machine can use a cast iron plate and aluminium oxide or silicon carbide slurries for conventional lapping. The machine's adjustable worktable can accommodate various parts for lapping. The roller bearing assemblies ensure smooth operation of the machine while maintaining the required load and pressure on the part being lapped.
For precision diamond lapping and polishing, the machine uses a Kemet composite lapping plate and Kemet's diamond slurries. The machine's ceramic-faced or stainless steel conditioning rings ensure contamination-free polishing. The Kemet diamond dispensing system and stirrer enable the machine to dispense diamond slurries evenly on the lapping plate. The machine's stainless steel pressure weights ensure uniform pressure on the part being lapped for consistent results.
| Model | Product Code |
|---|---|
| DiaCol 15 | 364427 |
| DiaCol 20 | 359859 |
| DiaCol 24 | 359869 |
The Kemet DiaCol machine is also capable of performing chemical mechanical polishing (CMP). CMP is a process that combines chemical and mechanical forces to remove surface material from a substrate. The machine uses a CHEM-H pad and COL-K polishing media for CMP. The integrated Akudisp fully programmable peristaltic pump unit enables the machine to dispense the CMP slurry evenly on the CHEM-H pad. It is important to note that the CMP process is corrosive, and parts that contact the COL-K must be either epoxy-coated, stainless steel, or aluminium for longer life and contamination-free polishing. The Kemet DiaCol machine is compatible with the Kemet magnetic polishing pad system, which makes changing polishing pads easy. The magnetic pad system ensures fast and secure attachment of polishing pads to the machine, reducing the time required for changing pads.
Which Machine for your Process?
Kemet Range
Diamond and conventional lapping processes on Kemet composite or cast iron lap plates. Wide range of surface finishes and stock removal rates on most materials. Sub-micron flatness.
KemCol Range
CMP (Chemical Mechanical Polishing) and Cerium Oxide superfinishing. Mirror polishing of materials that are difficult to polish using diamond or conventional abrasives.
DiaCol range
Combined Kemet / KemCol machines able to utilise any lapping and polishing processes on a single machine.
